Laser Micromachining Systems and Processing Services
JPSA is a leading supplier of industrial grade UV excimer, DPSS, and Pico-second laser micromachining systems and materials processing services to customers worldwide.
Our Key applications include advanced laser scribing and Lift-Off (LLO) of LEDs, thin film solar scribing, semiconductor, MEMS, research, biomedical, and industrial micromachining. JPSA’s novel laser systems operate at wavelengths from 157nm to 1064nm, and are essential to a growing set of today’s industrial micromachining applications.
JPSA’s experienced team of scientists and engineers work together in our Applications Lab to develop new techniques in laser-material interaction and high productivity laser systems and automation. The highly advanced IX series of laser workstations and JPSA’s laboratory services provide enabling technologies for a wide range of applications and organizations, from university research to start-ups and Fortune 500 companies. JPSA is dedicated to enabling our customers achieve a competitive advantage.
Featured Laser Micromachining System
IX-6000 Series, automation platform, Model IAP
Integrated Automation Platform (IAP)
The IAP provides full automation for laser micromachining applications in high 
volume production. When mated to the IX-6000 series of laser workstations, the IAP provides automatic load and unload of wafers from a cassette for laser processing.
The platform offers whole wafer alignment with a sophisticated vision system to perform focus adjustment, and location of fiducials for micron precision placement.
Laser Micromachining Systems and Job Shop Services:
- Turn-key laser systems
- High Volume Job Shop Services
- Automation including reel to reel, wafer loaders and motion control
- Custom lasers and Optical Systems
- Contract Manufacturing
- Materials Processing Applications Lab
- Excimer Laser Refurbishment
New - Featured Video
JPSA's UV Laser Micromachining System Breaking Down Air
UV Laser Glass Marking
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics