JPSA Opens Malaysia Area Service, Support Office
Manchester, New Hampshire, USA – J. P. Sercel Associates (JPSA) announces the opening of a customer service and support office in Malaysia that will focus exclusively on the combined territories of Malaysia, China, and Singapore, and provide service, installations, and training, and will stock spare parts for customers of JPSA’s laser workstations for wafer processing and micromachining.
The new service center will be headed by Chuan Ki (C.K.) Foo, a direct JPSA employee who will be based in Penang. C.K. Foo holds a Diploma in Electronic and Mechanical Engineering Technology from the Silicon Institute of Technology, Penang, Malaysia.
He previously served as Senior Field Service Engineer for the Malaysia installation of Besi Die Handling, Laurier & Datacon divisions. Prior to that experience, he served as Field Service Engineer for Kestronics (Singapore) Pte Ltd. He has more than a decade overall experience in technical service and support for major companies including Motorola.
In making the announcement, Rick Slagle, Sales and Marketing Director, said "We are confident that under Mr. Foo's direction we will be able meet increased demand and provide excellent service and timely support to all of our Asian customers."
Contact information is as follows:
Chuan Ki (C.K.) Foo
14, Lorong Segemal 5,
Taman Segemal
13400, Butterworth
Penang, Malaysia
Telephone: (60) 124288753
Email: CKFoo@jpsalaser.com
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics