JPSA Introduces Dual Side Scribe (DSS) Capability for JPSA Laser Systems
Manchester, New Hampshire, USA
JP Sercel Associates, Inc. (JPSA), a leader in LED wafer scribing systems introduces new Dual Side Scribe (DSS) processing for its laser wafer scribing systems. JPSA provides DSS capability across a wide range of laser wafer scribing systems to perform both front side and backside scribing for LED, sapphire, GaAs, Si, and metal wafers, depending on wafer processing requirements.
JPSA utilizes its proprietary backside camera technology to produce the highest accuracy with fast alignment times for the DSS systems. JPSA has achieved high throughput backside scribing at speeds up to 150mm per second with no debris or damage to the epi layer.
The DSS is available on all JPSA scribing systems, and is also a field upgrade to all existing JPSA scribing systems such as; IX 210, IX 300, IX 6100. The DSS system allows for easy conversion from front side to backside scribing.
Charlie Cuneo, President of JPSA, said, “For many years, JPSA has been at the forefront of advanced deep UV front side laser scribing. With our recent advances in backside scribing, namely a new laser absorption enhancement technique, we are able to offer our customers their choice of highly efficient scribing processes that best meets their production requirements.”
JPSA’s IX-260is a flexible, powerful, industrial-grade system designed for high-volume throughput and high-accuracy processing for large field of view (LFOV) applications, such as the LED liftoff process. The system is a UV laser workstation used for delamination (liftoff) of the epi layer from the sapphire wafer. This LLO advancement dramatically reduces time and cost of the LED fabrication process. This will allow JPSA customers to package more high-brightness, high-performance vertical LEDs.
In announcing the shipment to FOREPI, Charlie Cuneo, President of JPSA, said “FOREPI is recognized worldwide as a manufacturer of high performance LEDs, and JPSA’s IX-260 is the perfect tool for this application. The IX-260 provides our customers the ability to greatly enhance the performance, and the volume of LEDs produced. This improvement is also cost-effective because it reduces the operating time, allowing our customer to generate more high performance LED’s in an increasingly demanding market.”
For more information, visit www.jpsalaser.com, or contact the company at 220 Hackett Hill Road, Manchester, NH 03102 USA, Tel. Tel. 603.518.3200, fax 603.518.3298.
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JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
EU PVSEC
Feria Valencia, Spain
Septemeber 6-9
Booth L3/H4/A3
