Applications
Excimer and DPSS Laser Micromachining of Ceramics, Alumina, Greensheet (unfired) Ceramic
The following are examples of laser ceramic and Alumina processing at the JPSA applications laboratory.
Via drilling with a UV laser produces high hole-to-hole repeatability
20 micron square through-holes for probe cards in ceramics and polyimides (Kapton).
Microfluidics and micromachining in alumina ceramic
Micro grooves in an alumina ceramic shaft
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics