Applications
Thin Film Patterning and Micromachining using Excimer, DPSS and Ultrafast Lasers
The excimer laser is the ideal tool for selective removal of metallization layers from their substrates. Excimer laser thin film patterning is straightforward and fast. The UV energy densities required for the process are such that the film is removed from the substrate with one pulse of laser energy, with negligible thermal load to the substrate, and at an energy density too small to ablate the material itself.
Thin film patterning can be done with masks, using direct-write methods or direct-writing with galvanometer scanning. The precise energy density and UV wavelength required for the process is dependent on the film material and thickness, the substrate and the adhesion method between the film and substrate.
The following are examples of thin film patterning processing at the JPSA applications laboratory.
Indium tin oxide (ITO) thin film on PET, patterned using a JPSA excimer laser patterning system
Metal thin film patterned on glass substrate
Patterned with 193nm wavelength
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics