JPSA UV Laser Applications — Thin Film Patterning

The excimer laser is the ideal tool for selective removal of metallization layers from their substrates. Excimer laser thin film patterning is straightforward and fast. The UV energy densities required for the process are such that the film is removed from the substrate with one pulse of laser energy, with negligible thermal load to the substrate, and at an energy density too small to ablate the material itself.

Thin film patterning can be done with masks, using direct-write methods or direct-writing with galvanometer scanning. The precise energy density and UV wavelength required for the process is dependent on the film material and thickness, the substrate and the adhesion method between the film and substrate.

The following are examples of thin film patterning processing at the JPSA applications laboratory.

Other Applications: