Applications
Micromachining of Glass and Hard Materials Using Excimer, DPSS and Ultrafast Lasers
The following are examples of glass and hard materials processing at the JPSA applications laboratory.
Small holes in sapphire
Square blind holes, approximately 4µm wide, in glass
Square blind holes in glass, 2µm wide, showing tops and bottoms of holes
Zero taper hole through 1mm silicon nitride substrate
Blind via parallel processing in silicon nitride
Fused silica micromachined with 157nm excimer
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics