JPSA UV Laser Applications — Silicon
The following are examples of silicon processing at the JPSA applications laboratory.
Silicon wafer cut with UV laser showing clean edges
Backside thinning for IC failure analysis
248nm KrF excimer laser scribing
Cut width: 14µm
Cut speed: 16mm per second
Production rate: approximately 3 wafers per hour
355nm DPSS laser scribing
Cut width: 5 µm
Cut speed: 30 mm per second
Production rate: more than 5 wafers per hour
