Applications
Laser Micromachining of Silicon, Laser Scribing and Laser Dicing, Via Drilling, Semiconductor and Photovoltaic
The following are examples of silicon processing at the JPSA applications laboratory.
Silicon wafer cut with UV laser showing clean edges
Backside thinning for IC failure analysis
Laser scribing
Via Drilling in Silicon
Laser Dicing of Silicon
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics