Gallery
JPSA Laser Applications Gallery
JPSA excimer and DPSS laser systems are excellent tools for fabricating complex 2-D and 3-D structures (MEMS, MOEMS and micron-scale devices). Heat-free laser ablation facilitates exact tolerances without collateral damage to materials.
JPSA can micromachine features to exacting tolerances in a variety of materials. To see examples of micromachined parts created in the JPSA applications lab, choose from the following applications or materials:
- Ceramics
- Thin film patterning and ITO
- Glass and hard substances
- Ink-jet applications
- LED Lift-Off (LLO)
- Polymers
- Silicon
News and Events
JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
Semicon China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
Saratoga Technology, Booth 3563
BOET - Hall W3, Booth 3354
Laser World of Photonics China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
ETSC Technology, Booth 6624
BOET - Hall E3, Booth 6437