Gallery
JPSA Laser Applications Gallery
JPSA excimer and DPSS laser systems are excellent tools for fabricating complex 2-D and 3-D structures (MEMS, MOEMS and micron-scale devices). Heat-free laser ablation facilitates exact tolerances without collateral damage to materials.
JPSA can micromachine features to exacting tolerances in a variety of materials. To see examples of micromachined parts created in the JPSA applications lab, choose from the following applications or materials:
- Ceramics
- Thin film patterning and ITO
- Glass and hard substances
- Ink-jet applications
- LED Lift-Off (LLO)
- Polymers
- Silicon
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics