Laser Micromachining Systems and Processing Services
JPSA is a leading supplier of industrial grade UV excimer, DPSS, and Pico-second laser micromachining systems and materials processing services to customers worldwide.
Our Key applications include advanced laser scribing and Lift-Off (LLO) of LEDs, thin film solar scribing, semiconductor, MEMS, research, biomedical, and industrial micromachining. JPSA’s novel laser systems operate at wavelengths from 157nm to 1064nm, and are essential to a growing set of today’s industrial micromachining applications.
JPSA’s experienced team of scientists and engineers work together in our Applications Lab to develop new techniques in laser-material interaction and high productivity laser systems and automation. The highly advanced IX series of laser workstations and JPSA’s laboratory services provide enabling technologies for a wide range of applications and organizations, from university research to start-ups and Fortune 500 companies. JPSA is dedicated to enabling our customers achieve a competitive advantage.
Featured Laser Micromachining System
IX-6000 Series, automation platform, Model IAP
Integrated Automation Platform (IAP)
The IAP provides full automation for laser micromachining applications in high volume production. When mated to the IX-6000 series of laser workstations, the IAP provides automatic load and unload of wafers from a cassette for laser processing.
The platform offers whole wafer alignment with a sophisticated vision system to perform focus adjustment, and location of fiducials for micron precision placement.
Laser Micromachining Systems and Job Shop Services:
- Turn-key laser systems
- High Volume Job Shop Services
- Automation including reel to reel, wafer loaders and motion control
- Custom lasers and Optical Systems
- Contract Manufacturing and Job Shop services
- Materials Processing Applications Lab
- Excimer Laser Refurbishment
New - Featured Video
Downsizing of a SunPower Silicon Photovoltaic Cell
UV Laser Glass Marking
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics