IX-188 ChromaDice™
cutting edge in die singulation
The new JPSA IX-188 ChromaDice™ employs a revolutionary new solid-state 266nm laser in an industrial machining system and delivers the best performance in its class for wafer scribing and die singulation.
With its extremely high throughput, >99% die yield, and process automation, the ChromaDice leads the industry in price and performance. A 266nm laser and precision linear motor with high resolution XY part handling stages ensure high throughput. The platform is extremely flexible providing options such as stages for up to 6” wafers, and the patent pending Vortex Nozzle™ for debris removal.
- High Throughput: Up to 5 wafers/hour
- Excellent Die Yield: >99%, far less waste
- Narrow Cuts: Novel Optical System for high speed wafer dicing includes high precision optical mounts for stability and ease of adjustment.
- Stability: Integrated granite structure for stiffness and large thermal mass ensures rock solid stability and eliminates the need for routine and cumbersome realignment of the optical system. Additionally, a heavy-duty weldment frame integrates laser, beam delivery system and control electronics into a single fully enclosed Class I system.
- Reliable: Non-contact technique provides 24/7 maintenance-free operation.
- Versatile: “Scribe & Break” or dicing/cutting for GaAs, Si and other materials—scribes up to 6” wafers including front side scribing of sapphire LED wafers.
For more information, contact JPSA.
