IX-210 ChromaDice™ DPSS Laser Wafer Scribing System
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The JPSA ChromaDice™ system provides a new advance in wafer scribing. The JPSA wafer scribing system, using a UV DPSS laser at 266nm or 355nm wavelengths, gives you very narrow cut widths (as small as 2.5µm kerf) and unmatched throughput of up to twelve wafers per hour.Excellent die yield of 97 to 99 percent, and better than 99 percent system up-time means your investment pay for itself in a matter of months. At a low operating cost of less than $2 per wafer, and with the JPSA automatic wafer alignment process (less than one minute to align the wafer), the ChromaDice™ system introduces a new level of wafer scribing productivity
.The system features industrial grade reliability with R&D flexibility and comes standard with user-friendly control software. The JPSA SystemControls32 software seamlessly integrates all laser system functions with an easy-to-use interface.
The system is used for scribing LED wafers as well as GaAs and other III-V materials.
For more information, contact JPSA.
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics