JPSA IX-3000 High-Volume Excimer UV Laser Micromachining System

This "new generation" UV laser workstation is a high-throughput, step-and-scan ablation system for micromachining, drilling and laser processing. The flexible, powerful IX-3000 has a high-accuracy mask imaging system for large field of view (FOV) processing applications.

ix3000

The IX-3000 incorporates highly efficient lasers and optical beam technologies, enabling the use of less costly optics and systems components. Another benefit is a lower cost of ownership and operation and faster return on investment than competitive systems.

Optical resolution, repeatability and structural accuracies are submicron, with 0.2 to 0.3 micron repeatability.

The mask area, mask dynamics and step-and-repeat stages are customized and optimized to meet the needs of each customer's particular application.

The IX-3000 is granite-based, vibration and thermal dampened for optimum stability. The entire system is optimized for high-speed operation. All stages feature a high-accuracy air-bearing design and offer very fast move-and-settle performance.

The IX-3000 is available at 193nm or 248nm operating wavelengths, however, other excimer wavelengths can be used depending on the application. These applications can include:

The IX-3000 is surrounded by a cleanroom enclosure with a HEPA filtration system, mounted on the enclosure roof.

The IX-3000 is available with cassette-to-cassette wafer handling, panel handling, robotics handling, or tape and reel systems. The IX-3000 is designed to readily integrate with high-volume part handling systems.

Key features include:

For more information, contact JPSA.