Systems

IX-6100 ChromaDice™ DPSS Laser Micromachining Systems

 

High Volume Production System
The new IX-6100 ChromaDice™ solid state laser machining system delivers highspeed wafer singulation integrated with a state of the art wafer loading system. Featuring dual SMIF or FOUP load ports, the IX-6100 is ready for the most demanding wafer die singulation production task.

With operation costs of less than $2 per wafer, >99% process yields combined with ultra narrow kerf widths, the IX-6100 sets a new benchmark in process speed, die yield and ultrafast return on investment. Available with wavelengths from 1064nm to 266nm, the IX-6100 is ready for processing a variety of materials, from Si to Sapphire and, when equipped with JPSA’s patent pending Toxic Wafer Debris nozzle, materials such as GaAs and InP are handled with ease.

 

News and Events

JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:

See JPSA at:

EU PVSEC
Feria Valencia, Spain
Septemeber 6-9
Booth L3/H4/A29

EU PVSEC

  • JP Sercel Associates
    220 Hackett Hill Rd.
    Manchester, NH 03102 USA
  • PH:
    603.518.3200
  • FAX:
    603.518.3298