IX-6100 ChromaDice™ DPSS Laser Micromachining Systems
High Volume Production System
The new IX-6100 ChromaDice™ solid state laser machining system delivers highspeed wafer singulation integrated with a state of the art wafer loading system. Featuring dual SMIF or FOUP load ports, the IX-6100 is ready for the most demanding wafer die singulation production task.
With operation costs of less than $2 per wafer, >99% process yields combined with ultra narrow kerf widths, the IX-6100 sets a new benchmark in process speed, die yield and ultrafast return on investment. Available with wavelengths from 1064nm to 266nm, the IX-6100 is ready for processing a variety of materials, from Si to Sapphire and, when equipped with JPSA’s patent pending Toxic Wafer Debris nozzle, materials such as GaAs and InP are handled with ease.
- Full Automation: Includes part load/unload robotics, pre-aligners and vision system for unattended production. A variety of standard and custom end effectors are available for any part handling requirement.
- Large Workspace: The IX-6100 can be configured with stages compatible with wafers up to 300mm.
- High Throughput: >12 wafers/hour for 2" blue LEDs, >200mm/sec scribe rate for GaAs.
- Excellent Die Yield: >99%, far less waste.
- Narrow Cuts: Down to 2.5 microns, more die per wafer, more income potential, faster ROI.
- Low Cost: One ChromaDice replaces dozens of dicing saws or diamond scribers, proven to give 20-30 times higher wafer throughput.
- High Quality Process: No surface cracks, no zipper zones, no chip outs.
- Reliable: Non-contact technique provides 24/7 maintenance-free operation.
- Versatile: "Scribe & Break" or dicing/cutting for GaAs, Si and other materials-scribes up to 300mm wafers.
News and Events
JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
Semicon China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
Saratoga Technology, Booth 3563
BOET - Hall W3, Booth 3354
Laser World of Photonics China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
ETSC Technology, Booth 6624
BOET - Hall E3, Booth 6437