IX-6100 ChromaDice™ DPSS Laser Micromachining Systems
High Volume Production System
The new IX-6100 ChromaDice™ solid state laser machining system delivers highspeed wafer singulation integrated with a state of the art wafer loading system. Featuring dual SMIF or FOUP load ports, the IX-6100 is ready for the most demanding wafer die singulation production task.
With operation costs of less than $2 per wafer, >99% process yields combined with ultra narrow kerf widths, the IX-6100 sets a new benchmark in process speed, die yield and ultrafast return on investment. Available with wavelengths from 1064nm to 266nm, the IX-6100 is ready for processing a variety of materials, from Si to Sapphire and, when equipped with JPSA’s patent pending Toxic Wafer Debris nozzle, materials such as GaAs and InP are handled with ease.
- Full Automation: Includes part load/unload robotics, pre-aligners and vision system for unattended production. A variety of standard and custom end effectors are available for any part handling requirement.
- Large Workspace: The IX-6100 can be configured with stages compatible with wafers up to 300mm.
- High Throughput: >15 wafers/hour for 2" blue LEDs, >300mm/sec scribe rate for GaAs, Silicon and a variety of other substrates.
- Excellent Die Yield: >99%, far less waste.
- Narrow Cuts: Down to 2.5 microns, more die per wafer, more income potential, faster ROI.
- Low Cost: One ChromaDice replaces dozens of dicing saws or diamond scribers, proven to give 20-30 times higher wafer throughput.
- High Quality Process: No surface cracks, no zipper zones, no chip outs.
- Reliable: Non-contact technique provides 24/7 maintenance-free operation.
- Versatile: "Scribe & Break" or dicing/cutting for GaAs, Si and other materials-scribes up to 300mm wafers.
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics