IX-6600 ChromAblate™ Excimer Laser Micromachining Systems
High Volume Production System
IX-6600 ChromAblate™
The new IX-6600 ChromAblate™ UV and VUV excimer laser system is designed and optimized for demanding 24/7 high volume production applications. Whether micromachining features to 2um or configured for large area exposure of up to 5mm x 5mm, the IX-6600 is ready for any production challenge. Featuring dual cassette load ports, production grade robotics, wafer pre-aligners and vision, the IX-6600 is ready to take on the most demanding production challenges in a friendly easy to use Class I laser system.
Just some of the applications...
LED production, selective wafer annealing, micro-drilling, dicing and scribing,
ink jets, via drilling, blind holes, microfluidics, thin film patterning, selective
material ablation, MEMS, 3-D micromachining, fire-on-the-fly operation, and more.
- Full Automation: Includes part load/unload robotics, pre-aligners and vision system for unattended production. A variety of standard and custom end effectors are available for any part handling requirement.
- Large Workspace: The IX-6600 can be configured with stages compatible with substrates up to 300mm.
- High Throughput: >Up to 400Hz pulse rates.
- Micro Features: Down to 2.5 microns
- Reliable: Non-contact technique provides 24/7 maintenance-free operation.
Laser Micromachining
JPSA Laser provides excimer, Diode Pumped Solid State (DPSS), and Ultrafast laser micromachining solutions for:
- Thin Film PV Patterning
- Laser Scribing
- LED Lift-Off (LLO)
- Advanced Laser Lift-Off
- Metal Dicing
- Laser Dicing
- Via Drilling
- Silicon Edge Isolation
- Ink-Jet Nozzles
- Microfluidic Devices
- Micro Vias
- Annealing and Doping
- Parylene Ablation
- 3D Micro Features
- Concentrator Photovoltaics