IX-70 Precision Short Deletion
The new JPSA IX-70 ChromAblate™ on-target inspection and short deletion system delivers high precision and high power in an incredibly small package. Developed for the repair of flat panel displays, micro circuits and wafers, the IX-70 can be applied in a variety of micromachining applications.
A number of innovative features are incorporated into the IX-70. Precise control of the laser power is through an integrated adjustable attenuator. Various geometric shapes can be projected onto the work surface through an adjustable aperture for square or rectangular features and for round or other shaped features, an optional mask indexing wheel. For alignment and inspection of the work surface, the IX-70 incorporates a co-axial high resolution CCD camera, adjustable zoom lens and LCD dispay for real time process viewing.
- Multi-wavelength: Can be configured with IR, visible or UV wavelengths for a range of materials, from metals to polymers
- High power: Up to 90mJ at 1064nm, 50mJ at 532nm, 11mJ at 355nm or 10mJ at 266nm
- Precision control: Integrated laser attenuator
- Beam shaper: Adjustable rectangular aperture
- High resolution inspection: CCD camera with microscope zoom lens
- Reliable: Non-contact technique provides 24/7 maintenance-free operation
For more information, Contact JPSA.
News and Events
JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:
- Thin film PV patterning
- Laser scribing
- LED Lift-Off (LLO)
- Laser dicing
- Silicon edge isolation
- Ink-jet nozzles
- Microfluidic devices
- Micro vias
- Annealing and doping
- Parylene ablation
- Concentrator photovoltaics
See JPSA at:
Semicon China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
Saratoga Technology, Booth 3563
BOET - Hall W3, Booth 3354
Laser World of Photonics China
Shanghai New Int'l Expo Ctr (SNIEC)
Shanghai, China
March 16-18
ETSC Technology, Booth 6624
BOET - Hall E3, Booth 6437