The following table shows the achievable exposure area based on fluence:
Achievable Exposure Area: Raw Beam Energy vs. Fluence |
|||||
|---|---|---|---|---|---|
| Raw beam energy (2cm2 beam) |
0.5 J/cm2 | 1 J/cm2 | 5 J/cm2 | 10 J/cm2 | 25 J/cm2 |
| 100mJ | 0.5cm2 | 0.1cm2 | 0.04cm2 | 0.01cm2 | 0.008cm2 |
| 200mJ | 0.8cm2 | 0.2cm2 | 0.8cm2 | 0.02cm2 | 0.016cm2 |
| 400mJ | 1.6cm2 | 0.4cm2 | 0.16cm2 | 0.04cm2 | 0.032cm2 |
| 600mJ | 2.4cm2 | 0.cm2 | 0.24cm2 | 0.06cm2 | 0.048cm2 |
The next table shows the UV excimer laser ablation etch rate for different materials based on different energy densities:
Energy Densities for Selected Materials |
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|---|---|---|---|---|---|---|
| Process | MaterialType | Laser wavelength (nm) | Fluence (J/cm2) | Power Density (mW/cm2) |
Etch Depth/ Pulse (microns) |
Comments |
| Etching | Plastics | 193 248 308 |
0.5 to 2 | 50 to 200 | 0.1 to 1 | Imaging patterns, arrays |
| Etching | Ceramics and hard dielectrics |
193 248 308 |
5 to 15 | 500 to 1,500 | 0.1 to 0.3 | Imaging patterns, arrays |
| Etching | Metal foils | 193 248 308 |
5 to >20 | 500 to >2,000 | 0.1 to >0.25 | Imaging patterns, arrays |
| Drilling | Plastics >1mm |
193 248 308 |
3 to 50 | 300 to 5,000 | 0.2 to 4.5 | Spot imaging |
| Drilling | Ceramics and hard dielectrics |
193 248 308 |
20 to >50 | 2,000 to >5,000 | 0.2 to 5 | Spot imaging |
| Drilling | Metals | 193 248 308 351 |
20 to >50 | 2,000 to >5,000 | 0.2 to >10 | Spot imaging |
| Marking | Plastics | 308 351 |
0.5 to 2 | 50 to 200 | 0.1 to 1 | Imaging patterns, arrays |
| Marking | Ceramics and hard dielectrics |
308 351 |
1 to 15 | 100 to 1,500 | 0.1 to 0.3 | Imaging patterns, arrays |