Systems

JPSA Industrial Excimer and DPSS Laser Micromachining Systems

 

PV-5000 Thin Film Photovoltaics
Laser Scribing System

JPSA’s high throughput production system for scribing P1, P2, P3 and P4-border deletion. A wide range of lasers available to match the TAKT time required for production. A flexible system which can scribe film side or glass side with integrated debris management. The system incorporates multiple beamlets for fast processing with auto-focus to handle non-flat glass.

IX-3000 Micromachining System

JPSA’s high-throughput IX-3000 is an Excimer-based laser step and scan ablation system for micro-machining, drilling, and laser processing of a wide range of materials. Flexible, powerful, industrial-grade and designed for high-volume throughput, the IX-3000 is a high-accuracy mask imaging system for large field of view (LFOV) processing applications.

IX-6000 Series

A high-accuracy, ultra stable, excimer or DPSS laser workstation. The new IX-6000 series provides robotic wafer handling for up to 300mm diameter wafers.

IX-6100 Chromadice™ DPSS

The new IX-6100 ChromaDice™ solid state laser machining system delivers highspeed wafer singulation integrated with a state of the art wafer loading system. Featuring dual SMIF or FOUP load ports, the IX-6100 is ready for the most demanding wafer die singulation production task.

IX-6600 ChromAblate™ Excimer System

Whether micromachining features to 2um or configured for large area exposure of up to 5mm x 5mm, the IX-6600 is ready for any production challenge. Featuring dual cassette load ports, production grade robotics, wafer pre-aligners and vision, the IX-6600 is a versatile production tool in an easy to use Class I laser system. The part handling system and laser beam delivery optics are mounted to a granite support structure that is triple vibration isolated.
IX-200 Series

The 'Swiss Army Knife' of laser machining systems. Can be configured with either an excimer (IX-260) or DPSS (IX-200) laser for large area or direct write applications.

IX-210 Chromadice™ DPSS Using UV DPSS lasers at 266nm wavelengths, the ChromaDice wafer scribing system creates very narrow cut widths (as small as 2.5µm kerf) and unmatched throughput of up to 12 wafers per hour.

IX-260 ChromAblate™ Micromachining System Excimer laser-based system, similar in design to the IX-1200. Can be used in industrial or R&D environments.

IX-70 IX-70 Short Deletion Tool

Table top or gantry mounted DPSS laser system for on-target inspection and short deletion. Developed for the repair of flat panel displays, micro circuits and wafers, the IX-70 can be applied in a variety of micromachining applications.

 

News and Events

JPSA Laser provides excimer and Diode Pumped Solid State (DPSS) laser micromachining solutions for:

See JPSA at:

Photonics West
Booth 5124
Moscone Center
San Francisco, CA
Jan 26-28


PHOTON‘s Photovoltaic Technology Show
Booth I-11
Moscone Center-West Hall
San Francisco, CA
February 2 - 4, 2010


  • JP Sercel Associates
    220 Hackett Hill Rd.
    Manchester, NH 03102 USA
  • PH:
    603.518.3200
  • FAX:
    603.518.3298