JPSA Excimer and DPSS Laser Micromachining Systems
IX-3000 Micromachining System
JPSA’s high-throughput IX-3000 is an Excimer-based laser step and scan ablation system for micro-machining, drilling, and laser processing of a wide range of materials. Flexible, powerful, industrial-grade and designed for high-volume throughput, the IX-3000 is a high-accuracy mask imaging system for large field of view (LFOV) processing applications.
IX-1200 ChromAblate™
A high-accuracy, ultra stable, excimer laser workstation. The IX-1200 has a sturdy frame constructed of heavy wall, welded steel. The integrated laser is mounted on a triple vibration isolated frame. The laser can be easily removed from the system for laser service. The part handling system and laser beam delivery optics are mounted to a granite support structure that is also triple vibration isolated.
IX-200 Series
The 'Swiss Army Knife' of laser machining systems. Can be configured with either an excimer (IX-260) or DPSS (IX-200) laser for large area or direct write applications.
IX-200 Chromadice™ DPSS Using UV DPSS lasers at 266nm wavelengths, the ChromaDice wafer scribing system creates very narrow cut widths (as small as 2.5µm kerf) and unmatched throughput of up to 12 wafers per hour.
IX-260 ChromAblate™ Micromachining System Excimer laser-based system, similar in design to the IX-1200. Can be used in industrial or R&D environments.
IX-188 ChromaDice
The new JPSA IX-188 ChromaDiceT employs a revolutionary new solid-state 355nm laser in an industrial machining system and delivers the best performance in its class for wafer scribing and die singulation.
IX-70 Short Deletion Tool
Table top or gantry mounted DPSS laser system for on-target inspection and short deletion. Developed for the repair of flat panel displays, micro circuits and wafers, the IX-70 can be applied in a variety of micromachining applications.
