JPSA’s high throughput production system for scribing P1, P2, P3 and P4-border deletion. A wide range of lasers available to match the TAKT time required for production. A flexible system which can scribe film side or glass side with integrated debris management. The system incorporates multiple beamlets for fast processing with auto-focus to handle non-flat glass.

JPSA’s high-throughput IX-3000 is an Excimer-based laser step and scan ablation system for micro-machining, drilling, and laser processing of a wide range of materials. Flexible, powerful, industrial-grade and designed for high-volume throughput, the IX-3000 is a high-accuracy mask imaging system for large field of view (LFOV) processing applications.

A high-accuracy, ultra stable, excimer or DPSS laser workstation. The new IX-6000 series provides robotic wafer handling for up to 300mm diameter wafers.

IX-6100 Chromadice™ DPSS

IX-6600 ChromAblate™ Excimer System

The 'Swiss Army Knife' of laser machining systems. Can be configured with either an excimer (IX-260) or DPSS (IX-200) laser for large area or direct write applications.

IX-210 Chromadice™ DPSS Using UV DPSS lasers at 266nm wavelengths, the ChromaDice wafer scribing system creates very narrow cut widths (as small as 2.5µm kerf) and unmatched throughput of up to 12 wafers per hour.

IX-260 ChromAblate™ Micromachining System Excimer laser-based system, similar in design to the IX-1200. Can be used in industrial or R&D environments.

Table top or gantry mounted DPSS laser system for on-target inspection and short deletion. Developed for the repair of flat panel displays, micro circuits and wafers, the IX-70 can be applied in a variety of micromachining applications.